Amazon Files for $25 Billion Bond Sale to Fund AI Infrastructure Push
- Amazon launched an eight-part U.S. investment-grade bond offering targeting at least $25 billion, with proceeds earmarked for general corporate purposes including data centers, AI chips, and other infrastructure supporting an estimated $200B 2026 capex budget (Bloomberg).
- The company told underwriters the deal is intended to be its final debt issuance of 2026, making it one of the year's largest single corporate IG offerings and a key funding leg for hyperscaler AI build-out (Bloomberg).
- The sale follows TeraWulf's $19B AI lease with Anthropic and intensifying competition for AI compute, with issuance also tracking renewed investor appetite for high-grade paper.